Titel
Title | Low-k dielectric reliability in copper interconnects |
Auteur
Author | Li, Yunlong |
Promotor
Supervisor | Maex, Karen |
Co-promotor
Co-supervisor | Groeseneken, Guido |
Juryleden
Members of the jury | Froyen, Ludo
Willems, Yves
Afanasiev, Valeri
Puers, Robert
Beirlant, Jan
Mertens, Robert Pierre
Zsolt, Tõkei
Barth, Hans-Joachim |
Datum verdediging
Date doctoral defence | 21-Sep-2007 |
| Summary | The interconnect module is one of the most important processing modules in a ULSI CMOS technology. It takes care of the transmission of the signals between the active devices in semiconductor chips. In the past, aluminum was used as metal interconnection material, whereas SiO2-based dielectrics were used as insulators between the metal lines. By the continuous scaling of the critical dimensions (C more/meer ... |
| Samenvatting | De interconnectiemodule is een van de belangrijkste procesmodules van een ULSI CMOS technologie. Zij zorgt voor de transmissie van de signalen tussen de actieve devices in halfgeleiderchips. In het verleden werd hiervoor Aluminium gebruikt als interconnectiemateriaal, en een SiO2-gebaseerd dielectricum als isolator tussen de interconnectiebaantjes. Door de verdergaande schaalverkleining lopen de R more/meer ... |
Summary for the
general public | With the semiconductor technology advancement, various new materials are introduced into integrated chips (IC) to improve the chip performance. Low-k dielectrics are a kind of such new materials to reduce the time delay in signal transmission. However, the influence of new low-k materials on IC reliability needs detailed investigation. This PhD work investigates the fundamental reliability issues more/meer ... |
Inhoudstafel
Table of Contents | Contents
1 Introduction 1
1.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Research Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 State of The Art 7
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Copper Damascene Integration . . . . . . . . . . . . . . . . . . . 9
2.2.1 Single Damascene Integration . . . . . . . . . . . . . . . . 11
2.2.2 Dual Damascene Integration . . . . . . . . more/meer ... |
| URI | http://hdl.handle.net/1979/971 |
| Type | Doctoral thesis
Doctoraatsthesis |
| Accessibility | Publicly accessible |
| Toegankelijkheid | Publiek toegankelijk |
